Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications

Jo Tamura, Satoshi Sugaya, Hiroyuki Arai, Ken Ukawa, Toshihiko Katayama

研究成果: 書籍の章/レポート/Proceedings会議への寄与査読

抄録

This paper presents a new antenna-in-package (AiP) design that enlarges a patch antenna bandwidth for 5G mobile communications. Unlike conventional AiP methods, the proposed one has an advantage in enlarging an impedance bandwidth without modifying antenna geometry. The approach uses a dielectric cube with a relatively high permittivity, around 15 to 20. By mounting the cube on a patch antenna, The antenna bandwidth where the return loss is greater than 10 dB is broadened from 0.5 to 1.4 GHz without changing the resonant frequency of the antenna. The antenna is designed at 28 GHz, and the antenna characteristics are thoroughly compared based on three antenna types.

本文言語英語
ホスト出版物のタイトル2023 Asia-Pacific Microwave Conference, APMC 2023
出版社Institute of Electrical and Electronics Engineers Inc.
ページ558-560
ページ数3
ISBN(電子版)9781665494182
DOI
出版ステータス出版済み - 2023
外部発表はい
イベント31st Asia-Pacific Microwave Conference, APMC 2023 - Taipei, 台湾省、中華民国
継続期間: 5 12月 20238 12月 2023

出版物シリーズ

名前Asia-Pacific Microwave Conference Proceedings, APMC
ISSN(電子版)2690-3946

会議

会議31st Asia-Pacific Microwave Conference, APMC 2023
国/地域台湾省、中華民国
CityTaipei
Period5/12/238/12/23

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