Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications

Jo Tamura; Satoshi Sugaya; Hiroyuki Arai; Ken Ukawa; Toshihiko Katayama

doi:10.1109/APMC57107.2023.10439914

Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications

Jo Tamura, Satoshi Sugaya, Hiroyuki Arai, Ken Ukawa, Toshihiko Katayama

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

This paper presents a new antenna-in-package (AiP) design that enlarges a patch antenna bandwidth for 5G mobile communications. Unlike conventional AiP methods, the proposed one has an advantage in enlarging an impedance bandwidth without modifying antenna geometry. The approach uses a dielectric cube with a relatively high permittivity, around 15 to 20. By mounting the cube on a patch antenna, The antenna bandwidth where the return loss is greater than 10 dB is broadened from 0.5 to 1.4 GHz without changing the resonant frequency of the antenna. The antenna is designed at 28 GHz, and the antenna characteristics are thoroughly compared based on three antenna types.

Original language	English
Title of host publication	2023 Asia-Pacific Microwave Conference, APMC 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	558-560
Number of pages	3
ISBN (Electronic)	9781665494182
DOIs	https://doi.org/10.1109/APMC57107.2023.10439914
Publication status	Published - 2023
Externally published	Yes
Event	31st Asia-Pacific Microwave Conference, APMC 2023 - Taipei, Taiwan, Province of China Duration: 5 Dec 2023 → 8 Dec 2023

Publication series

Name	Asia-Pacific Microwave Conference Proceedings, APMC
ISSN (Electronic)	2690-3946

Conference

Conference	31st Asia-Pacific Microwave Conference, APMC 2023
Country/Territory	Taiwan, Province of China
City	Taipei
Period	5/12/23 → 8/12/23

Keywords

Antenna-in-package (AiP)
fifth-generation (5G)
millimeter-wave antenna
patch antenna
wideband antenna

Access to Document

10.1109/APMC57107.2023.10439914

Cite this

Tamura, J., Sugaya, S., Arai, H., Ukawa, K., & Katayama, T. (2023). Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications. In 2023 Asia-Pacific Microwave Conference, APMC 2023 (pp. 558-560). (Asia-Pacific Microwave Conference Proceedings, APMC). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APMC57107.2023.10439914

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abstract = "This paper presents a new antenna-in-package (AiP) design that enlarges a patch antenna bandwidth for 5G mobile communications. Unlike conventional AiP methods, the proposed one has an advantage in enlarging an impedance bandwidth without modifying antenna geometry. The approach uses a dielectric cube with a relatively high permittivity, around 15 to 20. By mounting the cube on a patch antenna, The antenna bandwidth where the return loss is greater than 10 dB is broadened from 0.5 to 1.4 GHz without changing the resonant frequency of the antenna. The antenna is designed at 28 GHz, and the antenna characteristics are thoroughly compared based on three antenna types.",

keywords = "Antenna-in-package (AiP), fifth-generation (5G), millimeter-wave antenna, patch antenna, wideband antenna",

author = "Jo Tamura and Satoshi Sugaya and Hiroyuki Arai and Ken Ukawa and Toshihiko Katayama",

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doi = "10.1109/APMC57107.2023.10439914",

language = "English",

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Tamura, J, Sugaya, S, Arai, H, Ukawa, K & Katayama, T 2023, Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications. in 2023 Asia-Pacific Microwave Conference, APMC 2023. Asia-Pacific Microwave Conference Proceedings, APMC, Institute of Electrical and Electronics Engineers Inc., pp. 558-560, 31st Asia-Pacific Microwave Conference, APMC 2023, Taipei, Taiwan, Province of China, 5/12/23. https://doi.org/10.1109/APMC57107.2023.10439914

Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications. / Tamura, Jo; Sugaya, Satoshi; Arai, Hiroyuki et al.
2023 Asia-Pacific Microwave Conference, APMC 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 558-560 (Asia-Pacific Microwave Conference Proceedings, APMC).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Katayama, Toshihiko

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AB - This paper presents a new antenna-in-package (AiP) design that enlarges a patch antenna bandwidth for 5G mobile communications. Unlike conventional AiP methods, the proposed one has an advantage in enlarging an impedance bandwidth without modifying antenna geometry. The approach uses a dielectric cube with a relatively high permittivity, around 15 to 20. By mounting the cube on a patch antenna, The antenna bandwidth where the return loss is greater than 10 dB is broadened from 0.5 to 1.4 GHz without changing the resonant frequency of the antenna. The antenna is designed at 28 GHz, and the antenna characteristics are thoroughly compared based on three antenna types.

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Millimeter-Wave Antenna-in-Package (AiP) Design of a Wideband Patch Antenna for 5G applications

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