Effects of copper surface oxidation and reduction on shear-bond strength using functional monomers

This study was conducted to clarify the influence of the copper surface oxidation and reduction on the shear-bond strength with functional monomers. Unheated copper specimens (UH; n = 88) were wet-ground. Three-quarters of the UH were then heated (HT). Two-thirds of the HT was then immersed in a hydrochloric acid solution (AC). Half of the AC was then reheated (RH). Each group was further divided into two groups (n = 11), which were primed by either 6-methacryloyloxyhexyl 2-thiouracil-5-carboxylate (MTU-6) or 10-methacryloyloxydecyl dihydrogen phosphate (MDP). The shear-bond strength tests were used for bonding with an acrylic resin. The surface roughness values and chemical states of the four groups were analyzed using a confocal scanning laser microscope and X-ray photoelectron spectroscopy (XPS). The shear-bond strengths of HT and RH were the lowest in the MTU-6-primed groups. The result of AC was significantly lower than others in the MDP-primed groups. The XPS results showed that the surfaces of UH and AC consisted of Cu₂O and Cu. The surface changed to CuO upon heating. The presence or absence of copper-oxide films showed the opposite trends in the effectiveness of MTU-6 and MDP to improve bond strength. The results could elucidate the effects of functional monomers on copper-oxide films.